Why PCB copper clad?

Copper clad refers to the area on the circuit board wiring on copper foil, connected to the ground, with increasing ground area, reducing the loop area, lower pressure drop, improve the power efficiency and anti-interference ability. Copper clad in addition to reduce ground impedance, at the same time, has the excellency of reducing the loop area, enhanced signal mirror circuits etc. Therefore, copper clad process technology plays a key role in PCB, incomplete, truncation mirror position loop or incorrect copper layer often leads to new interference, the negative impact on the use of the circuit board.

Copper clad process compared with thick film technology

LAM technology and DPC process
In LAM, craft, ceramic metallization of high energy laser beam to ceramic and metal ion state, make the two closely together, grow together. The LAM technology of copper clad with copper layer thickness control, graphics easy advantages such as control precision, ceramic circuit board copper thickness can according to customer request custom between mu m ~ 1 mm, line width, wire diameter can do 20 microns. That is to say, with the science and technology in the field of laser applications and thorough, copper clad PCB industry technology can already by laser technology for ceramic and metal layer is high, the effect of good performance, such as spent.
In DPC technology, USES is plating process, metal ceramic sputtering process commonly used in ceramic surface in turn form for chrome or titanium material adhesion layer and material for copper seed layer, adhesive layer can increase the adhesion strength of metal wires, copper seed layer, have the effect of the conductive layer.
Ceramic circuit boards in the PCB industry has many years of production and research and development experience, LAM, technology can do DPC technology can do.