2017/7/2浏览量:3688来源:广州贵宇
With the development of high power electronic products in the direction of miniaturization, high speed, the traditional FR - 4, aluminum substrates such as substrate material is no longer suitable for PCB industry toward the development of high power, wisdom, application, with the progress of science and technology, the traditional LTCC, DBC technology is gradually replaced by DPC, LAM technology. Represented by LAM, technology of laser technology more in line with the printed circuit board high-density interconnect, fine development. Laser drilling is the front end of the PCB industry and mainstream drilling technology, the technology and efficient, rapid, accurate, and has great application value.
Meriton ceramic circuit board
Domestic laser microporous technology is still in its stage of development, can be put into production of the enterprise is not much. Using short pulses and peak power of laser drilling on the PCB substrate, gathered in order to achieve high density of energy, material instantly remove, forming microporous process requirement, etc. The ablation is divided into both chemical ablation thermal ablation and light. Thermal ablation instantly absorbs high-energy laser refers to the substrate material, to complete the pore forming process. Photochemical ablation is referring to the ultraviolet area more than 2 ev electron volts of high energy and more than the results of the laser wavelength of 400 nm work together. This technology can effectively the destruction of the organic material of long molecular chains, formation of smaller particles, particles under the device suction force, can make the base material forming microporous quickly.
Meriton ceramic circuit board